Customer Background
Customer: Dongguan Hele Electronics Co., Ltd.
Industry: Bluetooth headset / earphone manufacturing
Main soldering target: PCB boards
Soldering process: Lead‑free soldering at 380°C
Pain Points & Challenges
The customer had been using their existing soldering tips and faced a persistent issue:
During soldering operations, the tip frequently touched adjacent cylindrical components, causing damage to these components and increasing production costs and inefficiencies.
Root cause analysis: The front end of the currently used tip was too bulky, making it prone to contact with surrounding components during point‑to‑point soldering.
Our Solution
Product matching: Based on the physical samples provided by the customer, we designed the dimensional parameters and incorporated the soldering machine model to produce a customised tip drawing best suited for this specific application.
Parameter optimisation: Since the tip head volume was reduced, we recommended slightly increasing the soldering temperature to ensure consistently good soldering performance and stability.
Usage Feedback
The usage feedback is shown in the chat records below.